Product category: PCB Connectors
News Release from: Advanced Interconnections Corp | Subject: B2B
Edited by the Electronicstalk Editorial Team on 15 May 2007
PCB connectors raise I/O density
High-density SMT connector is now available in a 500-position footprint on 1.27mm pitch for high I/O board to board applications where durability and reliability are critical
The B2B high-density SMT connector line from Advanced Interconnections Corp is now available in a 500-position footprint on 1.27mm pitch. Designed for high I/O board to board applications where durability and reliability are critical, such as servers and routers, the newest member of the B2B SMT connector series is available in a standard mated height of 6.00mm and boasts low insertion and withdrawal forces.
This article was originally published on Electronicstalk on 15 May 2007 at 8.00am (UK)
Related stories
Interposers ease BGA device transitions
BGA interposers offer a cost-effective method for converting lead-free BGA device packages for use on boards processed with tin/lead solder profiles
The B2B SMT connector line employs screw-machined terminals with multifinger contacts and the company's exclusive solder ball terminal design; field-proven for superior reliability and processing results.
With a current rating of 3A per pin, more contacts can be assigned to data/signal transfer (fewer pins are sacrificed for power/ground).
These high quality terminals, coupled with a precision moulded LCP insulator, offer a more rugged and durable contact system that is better suited for blind mating applications.
RoHS compliant Sn/Ag/Cu solder ball terminals are available, along with tape and reel packaging for automated pick and place.
• Advanced Interconnections Corp: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
