Product category: Plugs and Sockets
News Release from: Advanced Interconnections Corp | Subject: IC sockets and adapters
Edited by the Electronicstalk Editorial Team on 20 February 2006
Shortform updates RoHS-compliant socket range
A new shortform catalogue features up-to-date material specifications and part numbers for RoHS compliant IC sockets and adapters for BGA, PGA, DIP and SIP packages
Advanced Interconnections Corp has published a new shortform catalogue featuring up-to-date material specifications and part numbers for RoHS compliant IC sockets and adapters for BGA, PGA, DIP and SIP packages. The RoHS compliant sockets are available in a choice of insulators, including FR-4, Peel-A-Way removable carriers, and new high temperature moulded LCP.
This article was originally published on Electronicstalk on 20 February 2006 at 8.00am (UK)
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All three insulators meet the directive's requirements for material content and are qualified to withstand the higher processing temperatures required in lead-free processing (up to 260C).
In addition to existing gold plating, Advanced now offers matte tin terminal plating and new tin/silver/copper (95.5Sn/4.0Ag/0.5Cu) solder ball and solder preform terminals for RoHS applications.
For exempt applications, traditional tin/lead plating, solder preforms and eutectic solder ball terminals are still offered.
The 24-page catalogue is available in either hard copy or a PDF file from the company's website.
Datasheets for additional products including board to board connectors, adapters and the company's extensive line of screw-machined terminals are also available online.
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