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Product category: Programmable Logic Devices
News Release from: Actel Europe | Subject: RT54SX32S-CC256M
Edited by the Electronicstalk Editorial Team on 05 December 2003
Novel package puts programmed FPGAs in
space
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A novel advanced packaging technology is small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for space applications.
A novel advanced packaging technology is small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for space applications Capable of delivering products with a form factor similar to bare die, the new ceramic chip carrier land grid (CCLG) package eliminates the handling, testing and programming challenges associated with using known good die (KGD) in MCMs
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