Product category: Networking Hardware
News Release from: Adax Europe | Subject: HDCIII board
Edited by the Electronicstalk Editorial Team on 13 February 2007
High density SS7
controller handles more trunks
High density SS7 controller for NGN convergence platforms offers up to eight trunks and therefore increased connections per system
Signalling provider, Adax, is launching the HDCIII board, a high density SS7 controller for NGN convergence platforms offering up to eight trunks and therefore increased connections per system. The board will help operators manage their expanding system requirements, driven by exponential growth in subscribers, making them more scalable whilst reducing costs.
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The HDCIII boasts up to eight T1, E1 or J1 trunks, and offers a combination of up to 128 MTP2 Low Speed Links (LSLs) and eight High Speed Links (HSLs).
PMC, AMC, PCI/X and PCIe versions of the board will be available, all using Adax's common software driver and consistent API to enhance flexibility and scalability, reduce time to market for new services, maximise application portability and protect investment.
Robin Kent, Director of Operations at Adax Europe, comments: 'It took 100 years to get the first billion telecom subscribers, but the continual high demand from developed and emerging markets, such as Brazil, Russia, India and China (BRICs), means that the next billion will appear in just ten years'.
Further reading
Controller switches to PCI Express
Low-profile PCI Express form factor HDCII controller provides support for the expanding variety of mid-range servers currently marketed to the telecommunications industry
'Recognising that this huge growth is on the horizon, Adax is launching the HDCIII controller to support equipment manufacturers and operators with a robust, highly scalable, portable and reliable signalling infrastructure'.
The HDCIII onboard processor performs many thousands of transactions per second, placing minimal load on the host, maximising application performance and ensuring no degradation of service for the customer.
With up to 128 MTP2 LSLs and eight HSLs the board has one of the highest densities on the market, and with a large amount of redundancy built in, it can run more connections concurrently than comparable devices.
As a result, it is particularly suitable for carrier-level applications that require high capacity and throughput, such as VAS applications as well as SGs, MGCs, SGSNs, GGSNs, MSCs, HLRs/VLRs and BSS nodes.
Kent concluded: 'Flexibility is key when developing telecommunications infrastructures for the future, and we recognise this need throughout our product development'.
'With the HDCIII, all hardware formats, such as PMC, AMC, PCI and PCIe, are supported by a single architecture and software driver so that applications are portable across all systems and all features can be managed through a single API.
Furthermore, since the HDCIII has a consistent API with the previous generations of HDC cards, current customers can easily upgrade their applications/systems/architecture with minimal development time'.
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